| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate processing method and a substrate processing apparatus capable of improving throughput of an apparatus even while positively eliminating a processing liquid remaining and adhering on a nozzle or a supplying means connected to the nozzle. SOLUTION: A liquid reservoir formed between a lower cleaning nozzle 29 and the bottom surface of a wafer is sucked via two needle valves 84, 85 by opening an opening/closing valve 81 with an opening/closing valve 86 closed. The needle valve 85 is adjusted so as to have a second flow rate (FV2) smaller than a first flow rate (FV1), the suction velocity of the liquid reservoir is controlled by the needle valve 85, and the liquid reservoir is sucked at a first velocity (V1) set at a relatively slow velocity. When the liquid reservoir is captured in the inside of the nozzle 29, the opening/closing valve 86 is opened, and the suction velocity of the liquid reservoir is switched to a second velocity (V2) higher than the first velocity controlled by the needle valve 84. COPYRIGHT: (C)2007,JPO&INPIT
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