| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition for semiconductor encapsulation which is highly thermo-conductive and effective for reducing warps for encapsulated wire sweeps and area-mounted packages. SOLUTION: The inorganic fillers used in the epoxy resin composition for semiconductor encapsulation include (d1) a first spherical alumina with an average particle size of not less than 40μm and not more than 70μm, (d2) a second spherical alumina with an average particle size of not less than 10μm and not more than 15μm, (d3) a first spherical silica with an average particle size of not less than 4μm and not more than 8μm and (d4) a second spherical silica with an average particle size of not less than 0.05μm and not more than 1.0μm. The amount of the spherical silica accounts for not less than 17% and not more than 23% of the total inorganic fillers. (d3)/(d4)=1/8-5/4. The amount of the inorganic fillers accounts for 85%-95% of the total resin composition by weight. The semiconductor device is encapsulated with the composition. COPYRIGHT: (C)2007,JPO&INPIT
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