| 摘要 |
PROBLEM TO BE SOLVED: To provide a lead-free joining material which can reduce the amount of the warpage of workpieces to be joined, and a body obtained by joining with the same joining material. SOLUTION: The invented lead-free joining material is intended to join two workpieces different in the coefficient of thermal expansion which are used for an electronic component, and has perfect cleavage nature in Sn or Sn alloy, and contains an ore powder having a layer structure. COPYRIGHT: (C)2007,JPO&INPIT
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