发明名称 |
Multifunctional metallic bonding |
摘要 |
Methods are provided for producing a transfer layer of a semiconductor material on a final substrate. In some embodiments, the transfer layer is produced on the final substrate by forming a layer of semiconductor material on an initial support, assembling that layer and a final substrate by metal bonding, and mechanically separating the initial support from the layer at a weak interface that initially attached the layer to the initial support. An intermediate substrate can be obtained which can be used to fabricate a variety of components such as light-emitting diodes or laser diodes. These techniques can produce a transfer layer on a final substrate and a recyclable initial support that can be detached from the transfer layer for recycling by a non-destructive mechanical release.
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申请公布号 |
US2006228820(A1) |
申请公布日期 |
2006.10.12 |
申请号 |
US20060447863 |
申请日期 |
2006.06.07 |
申请人 |
KERDILES SEBASTIEN;LETERTRE FABRICE;MORALES CHRISTOPHE;MORICEAU HUBERT |
发明人 |
KERDILES SEBASTIEN;LETERTRE FABRICE;MORALES CHRISTOPHE;MORICEAU HUBERT |
分类号 |
H01L21/00;H01L21/30;H01L21/762;H01L33/00 |
主分类号 |
H01L21/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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