| 摘要 |
A method for fabricating a microelectromechanical or microoptoelectromechanical component has the following steps: - Producing a first layer composite having a first substrate (2) and a first insulating layer (3), which covers at least part of the surface (1) of the first substrate (2), producing a second layer composite having a second substrate (12) and a second insulating layer (14) which covers at least part of the surface (13) of the second substrate (12), applying an at least partially conductive structure layer (7) onto the first insulating layer (3), applying the second composite onto the structure layer (7) such that the second insulating layer (14) adjoins the structure layer (7), - the first and second layer composites and the structure layer (7) being designed such that at least part of the structure layer (7) which contains the active area (8) of the microelectromechanical or microoptoelectromechanical component is hermetically sealed tightly by the first and second layer composites, and - forming contact holes (4) for the purpose of making contact with conductive regions (9) of the structure layer (7) within the first and/or second substrate (2, 12). |
