| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a solid-state image sensing device which can be reduced in size, to provide electronic equipment, and to provide a method of manufacturing the solid-state image sensing device. <P>SOLUTION: The solid-state image sensing device is equipped with a board 8, an image sensing element 7, and a lens unit which is mounted on the board 8 to support a lens group 5 and surrounds the image sensing element 7. A projection 10 is formed on the object-side surface of the board 7 extending toward an object, a recess 10a is formed at the end of the lens unit opposite to its other end facing the object, and the projection 10 is fitted into the recess 10a to position the lens unit on the board 8. <P>COPYRIGHT: (C)2007,JPO&INPIT |
