| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photosensitive resin composition that is superior in resolution, adhesion, flexibility and peelability and a photosensitive dry film resist that uses the same. <P>SOLUTION: The photosensitive resin composition contains a carboxyl group-containing polymer (A), an ethylenically unsaturated compound (B) and a photopolymerization initiator (C), where the ethylenically unsaturated compound (B) contains at least a compound (B1) represented by Formula (1) wherein A denotes H or a substituted or unsubstituted 1-20C alkyl group; X and Y each denote -CH<SB>2</SB>CH(CH<SB>3</SB>)O-, -CH(CH<SB>3</SB>)CH<SB>2</SB>O- or -CH<SB>2</SB>CH<SB>2</SB>O- and may be the same or different; Z denotes a bivalent 2-20C hydrocarbon group; k denotes an integer of 0 or 1; l1, l2 and l3 are each an integer of ≥0, where l1+l2+l3 denotes an integer of 3-18; m1, m2 and m3 are each an integer of ≥0, where m1+m2+m3 denotes an integer of 3-25; n1, n2 and n3 are each an integer of ≥0, where n1+n2+n3 denotes an integer of 3-30; and R denotes H or methyl. <P>COPYRIGHT: (C)2007,JPO&INPIT |
