发明名称 ELECTRONIC CIRCUIT COMPONENT, MANUFACTURING METHOD THEREOF AND SEMICONDUCTOR PACKAGE
摘要 <p><P>PROBLEM TO BE SOLVED: To provide an electronic circuit component capable of being downsized at a low cost. <P>SOLUTION: The electronic circuit component (10) includes a pair of lower electrodes (15a) extending in parallel to a first direction, dielectric layers (16) formed alternately across the longitudinal center line between the pair of lower electrodes at diagonal positions of the corresponding lower electrodes, and a pair of upper electrodes (15b) extending in parallel to a second direction orthogonal to the first direction; and constitutes capacitors (17) alternately located on a substrate (14). <P>COPYRIGHT: (C)2007,JPO&INPIT</p>
申请公布号 JP2006278553(A) 申请公布日期 2006.10.12
申请号 JP20050093003 申请日期 2005.03.28
申请人 FUJITSU LTD 发明人 OMOTE KOJI
分类号 H01G4/33;H01G4/30;H01G4/40;H01L23/12;H05K1/16 主分类号 H01G4/33
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