| 摘要 |
PROBLEM TO BE SOLVED: To provide a flexible metal laminate which is used in treatment to push a projection like a bump at high temperatures and can solve a problem caused by the deformation of a resin layer etc., and a flexible printed circuit board using the laminate. SOLUTION: The flexible metal laminate comprises a metal layer 10 and a resin layer 11. The resin layer is divided into two at a place 1/2 in thickness. When the side of a contact surface 13 with the metal layer 10 is made a first specimen 11a and the rest is made a second specimen 11b, a penetration displacement quantity (L1) from the contact surface 13 with the metal layer 10 of the first specimen 11a is smaller than a penetration displacement quantity (L2) from the opposite surface (outermost surface) 12 to the metal layer 10 of the second specimen 11b. COPYRIGHT: (C)2007,JPO&INPIT |
