| 摘要 |
PROBLEM TO BE SOLVED: To reduce the amount of warpage of a printed wiring board after heat treatment while suppressing loss due to a separate process without deteriorating product performance by contriving a conductive pattern formed on the board. SOLUTION: The printed wiring board includes a board 2 made of insulating material, strip line 1 provided on the surface of the board 2, and a ground metal layer 3 provided on the back side of the board 2. Then, openings 4 reaching the board 2 are formed in the ground metal layer 3. A radio wave receiving converter and an antenna device are provided with the above-mentioned printed wiring board. COPYRIGHT: (C)2007,JPO&INPIT
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