THERMOSETTING ANISOTROPICALLY CONDUCTIVE ADHESIVE

摘要

PROBLEM TO BE SOLVED: To provide an anisotropically conductive adhesive which can assure good conduction reliability without causing the corrosion of an ITO electrode connected therewith without using an inorganic ion scavenger or a hydrophobic oligomer and has excellent film forming properties. SOLUTION: In a thermosetting anisotropically conductive adhesive prepared by dispersing conductive particles in an epoxy resin composition, the epoxy resin composition is formulated with an adamantyl (meth)acrylate and a bisphenyl type (meth)acrylate. COPYRIGHT: (C)2007,JPO&INPIT