| 摘要 |
PROBLEM TO BE SOLVED: To provide a cleaning method capable of removing stuck foreign matters without grinding a heater chip as much as possible and to provide a cleaning device used for the cleaning method. SOLUTION: After performing thermocompression bonding by the heater chip 11, a counter surface 12 is arranged on the first surface 81A of a first peeling member 81 near a first corner part 81a and is brought into contact with the heater chip 11 (arranging process), and the first peeling member 81A is relatively slid parallelly to the counter surface 12 with the first corner part 81a as a moving direction head side (stuck object peeling process). At the time, at least the first corner part 81A is slid over the entire contact area. The first peeling member 81A is arranged on a file base 4 in parallel with a plate file and a second peeling member, and is fixed by a ball plunger part through a pressing base. COPYRIGHT: (C)2007,JPO&INPIT
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