| 摘要 |
A semiconductor device comprising a metallic leadframe ( 103 ) with a first surface ( 103 a) and a second surface ( 103 b). The leadframe includes a chip pad ( 104 ) and a plurality of segments ( 107 ); the chip pad is held by a plurality of straps ( 105 ), wherein each strap has a groove ( 106 ). A chip ( 101 ) is mounted on the chip pad and electrically connected to the segments. A heat spreader ( 110 ) is disposed on the first surface of the leadframe; the heat spreader has its central portion ( 110 a) spaced above the chip connections ( 108 ), and also has positioning members ( 110 b) extending outwardly from the edges of the central portion so that they rest in the grooves of the straps. Encapsulation material surrounds the chip, the electrical connections, and the spreader positioning members, and fills the space between the spreader and the chip, while leaving the second leadframe surface and the central spreader portion exposed.
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