| 摘要 |
A wafer processing tape where a bond layer (1) and a viscous adhesive layer (2) are provided on a base material film (3) surface. The wafer processing tape has a region where B > A is satisfied and a region where A > B is satisfied, where A is a separation force between the base material film (3) and the bond layer (1), and B is a separation force between a body (4) to be attached and the bond layer (1), and also between a body (5) to be attached and the viscous adhesive layer (2). In picking up, the bond layer (1) moves to the chip side in the region where B > A is satisfied, and in separation of the tape, the viscous adhesive layer (2) does not move to the body (5) in the region where A > B is satisfied. |
