| 摘要 |
<P>PROBLEM TO BE SOLVED: To solve the problem that the chip-to-chip distance becomes wide and no white light can be obtained at other positions than those distant from the light emitting surface, if taking the packing density and the extrusion of adhesives such as Ag paste or short circuit prevention into consideration when packing RGB LED chips individually. <P>SOLUTION: The multichip type white light source device is manufactured by forming a light emitting element (red LED) 12 on a first substrate 11, forming light emitting elements (blue LED and green LED) 16, 17 on a second substrate 15, laminating both substrates 11, 15 so that both light emitting elements are not superposed one above the other, and electrically connecting a wiring layer 13 with electrodes 18 through, e.g., bumps 19, thus reducing the mutual spacing of the light emitting elements to dispose closely them apparently without gap therebetween. <P>COPYRIGHT: (C)2007,JPO&INPIT |
