PLASMA FORMATION DEVICE AND PLASMA TREATMENT DEVICE AS WELL AS PLASMA FORMATION METHOD AND PLASMA TREATMENT METHOD

摘要

PROBLEM TO BE SOLVED: To provide a plasma treatment device and a treatment method for preventing damages by plasma on conductive/semi-conductive treated surface or a conductive/semi-conductive treated thin film by efficiently applying a plasma treatment on the surface or the thin film in an atmospheric pressure.

SOLUTION: The plasma formation device 2 is composed of a plasma generation part 4 with a gliding arc electrode pair 18 with a distance between the electrodes becoming larger toward a working gas moving direction and an emission port 20 emitting plasma to the plasma generation part 4, with a tip of the electrode pair 18 located inside the emission port 20. The working gas 14 above or near an atmospheric pressure is to be supplied between the electrodes by a working gas supply means and arc 4a generated between the electrodes at impression of voltage produces gliding arc moving toward a wider opening of the electrodes to form plasma. The plasma formation device 2 radiates this plasma from the emission port 20.

COPYRIGHT: (C)2007,JPO&INPIT