RESIN LAYER CURING APPARATUS AND RESIN LAYER CURING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a resin layer curing apparatus capable of correcting a substrate along with cooling at the time of curing of a resin layer to prevent the occurrence of warpage, and a resin layer curing method. SOLUTION: The resin layer curing apparatus is equipped with a turntable 1 on which substrates P1 and P2 for a disk are placed, a lamination part 2 for laminating the superposed substrates P1 and P2 and an ultraviolet irradiation part 3 for emitting ultraviolet rays. The ultraviolet irradiation part 3 has a light source 31 for irradiating the disk D after lamination with ultraviolet rays U. A cooling gas blowing part 32 constituted of a transparent material pervious to ultraviolet rays U is arranged between the light source 31 and a susceptor 4 on which the disc D is placed. The cooling gas blowing part 32 is connected to a gas supply device 41, which supplies a cooling gas G, through a gas introducing part 32b and a large number of blowing holes 32a are formed to the bottom part of the cooling gas blowing part 32. COPYRIGHT: (C)2007,JPO&INPIT