| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device in which poor connection between a wiring board and a semiconductor chip can be reduced during heat treatment, and poor connection between the wiring board and the mounting substrate can be reduced during packaging accompanying heat treatment. <P>SOLUTION: The semiconductor device comprises a semiconductor substrate having a first surface, a second surface which is the rear surface of the first surface, and a first through electrode penetrating the first and second surfaces, a semiconductor chip composed of the same kind of a material as that of the semiconductor substrate and mounted on the first surface of the semiconductor substrate while being connected electrically with the first through electrode, a flexible stress relax portion formed on the second surface of the semiconductor substrate while being connected electrically with the first through electrode, and an external connection terminal connected with a first conductor on the stress relax portion. <P>COPYRIGHT: (C)2007,JPO&INPIT |
