发明名称 INSULATED HEAT TRANSMISSION STRUCTURE AND SUBSTRATE FOR USE OF POWER MODULE
摘要 PROBLEM TO BE SOLVED: To provide an insulated heat transmission structure and a substrate for use of a power module, capable of efficiently conducting heat on a heat generator to a heat radiator for heat radiation, and also being able to exhibit stable performance over a long time, even with thermal deformation applied by an action of a temperature cycle or the like. SOLUTION: The insulated heat transmission structure 1 includes an insulation layer on at least part of the surface of a plate-like heat transfer member 4, made of pure Al or an Al alloy. The insulation layer 2 includes a ceramic layer 6 on which a film of ceramic, consisting of one or two or more of compositions including Al<SB>2</SB>O<SB>3</SB>, Si<SB>3</SB>N<SB>4</SB>and AlN, is formed directly on the heat transfer member. In addition, the coefficients of the thermal expansion of ceramic layers 6, 7 and 8 that are laminated to constitute the insulating layer 2 are structured so as to sequentially decrease, starting from the heat transfer member 4 going toward the surface of the insulating layer 2. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2006278558(A) 申请公布日期 2006.10.12
申请号 JP20050093034 申请日期 2005.03.28
申请人 MITSUBISHI MATERIALS CORP 发明人 TAMAO YOSHITAKA;KUROMITSU YOSHIO;KOMABAYASHI MASASHI
分类号 H01L23/36;H01L23/12;H01L25/07;H01L25/18 主分类号 H01L23/36
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