| 摘要 |
PROBLEM TO BE SOLVED: To provide the pad arrangement of a data system in which a wiring impedance from a pad is small and which is capable of high-speed data transmission, and a semiconductor device provided with the pad arrangement, and capable performing the high-speed data transmission. SOLUTION: For the pad arrangement of the data system, the arrangement of power supply wiring and ground wiring is contrived to be longer than the wiring length of the pad and a solder ball land, and the reduction of effective inductance is taken priority. The array of the pads is turned to two-column arrangement, and one unit of the pad arrangements is constituted such that a power supply for data and the ground are made adjacent or one line of data is inserted between the power supply for the data and the ground. By the constitution, mutual inductance between the power supply for the data becomes small, mutual inductance between the power supply for the data and the ground becomes large, the effective inductance of the power supply for the data and the ground is reduced, and thus power supply and ground noise is reduced. COPYRIGHT: (C)2007,JPO&INPIT
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