METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To facilitate the use of a contact part for inspection in an inspection processes having an identical configuration for semiconductor devices having different chip sizes. SOLUTION: Conducting an electrical test as a job lot by arranging contact pins 102 of the contact-fixing board 103 of a semiconductor testing device 106 corresponding to the all electrodes of solder bumps 108 of a plurality of semiconductor devices 107 on a wafer level CSP body 101 makes possible the use of the same board 103 to the other smiconductor devices. COPYRIGHT: (C)2007,JPO&INPIT