| 摘要 |
PROBLEM TO BE SOLVED: To facilitate an automatic correction of a bonding time at the time of the die bonding to satisfy both of a stabilization of a bonding quality and an improvement of the productivity. SOLUTION: The die bonding responding to a collet temperature with unwasted bonding time can be conducted by providing a device-operating-stop-time measuring part 10 and a collet-exchange-history storing part 11, further by providing a parameter-auto-correction part 12 for automatically computing an optimum bonding time responding to the operational status of the device and the collet-exchange-status, and by setting the bonding time by estimating the temperature of a collet 1 from the operational status of the device and the collet-exchange-history information. COPYRIGHT: (C)2007,JPO&INPIT
|
