| 摘要 |
PROBLEM TO BE SOLVED: To reliably join a ceramic board to a carrier with a solder even when a curve or swell occurs in the ceramic board or carrier, thereby preventing a leakage of radio waves from a waveguide. SOLUTION: This high frequency circuit board comprises a multilayered ceramic board 1 on which a plurality of pads 8 are formed on a joining face to a carrier board 2 and semiconductor electronic parts 5 are mounted for propagating radio waves, and the carrier board 2 which has waveguide holes 7 for passing the radio waves propagated by the semiconductor electronic parts 5 and retains the multilayered ceramic board 1. Bumps 10a, 10b are formed in the plurality of pads 8 of the multilayered ceramic board 1 by a high temperature solder, respectively, and the plurality of bumps 10a, 10b are joined to the carrier board 2 by a low temperature solder 11 with a lower melting temperature than the bumps 10a, 10b, whereby the multilayered ceramic board 1 is joined to the carrier board 2. The bumps 10a, 10b are formed so that the heights are different so as to follow a face shape of the carrier board 2. COPYRIGHT: (C)2007,JPO&INPIT
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