| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate packaging structure in which a circuit board and a semiconductor substrate are made not to be stripped easily from an adhesive layer, and more positive electrical connection is ensured between the first terminal of the circuit board and the second terminal of the semiconductor substrate. SOLUTION: The substrate packaging structure (60) comprises a first substrate (40) provided with a first terminal (42), a second substrate (50) provided with a second terminal (52), and an adhesive layer (20) for bonding the first substrate (40) and the second substrate (50) such that the first terminal (42) and the second terminal (52) are connected electrically wherein the adhesive layer (20) has a resin (21) and insulating particles (22) dispersed into the resin (21). The insulating particles (22) have a predetermined mean particle diameter, the first terminal (42) has a portion (43) closest to the second terminal (52) in an electric passage from the first terminal (42) to the second terminal (52), and the closest portion (43) has a width narrower than the predetermined mean particle diameter of the insulating particles (22). COPYRIGHT: (C)2007,JPO&INPIT
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