| 摘要 |
A semiconductor processing system includes a thickness monitoring system, a position monitoring system, and a processor. The processor is configured to receive information indicative of a local thickness of a layer on a substrate during processing, and information indicative of a position of the substrate during processing. The system may include an energy source to receive parameters from the processor, and to selectively output energy based on the parameters. The information indicative of a local thickness of a layer on a substrate may be indicative of a radial thickness distribution.
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