| 发明名称 |
SUBSTRAT ZUR MONTAGE VON HALBLEITERCHIPS |
| 摘要 |
A substrate for mounting a semiconductor chip having bumps using an adhesive thereon, said substrate being, for instance, provided with an insulating coating having an opening in the semiconductor chip mounting area so that the wiring conductors will not be exposed to the substrate surface near the boundary of the semiconductor chip mounting area, is improved in connection reliability and has high mass productivity. <IMAGE> |
| 申请公布号 |
DE69835747(D1) |
申请公布日期 |
2006.10.12 |
| 申请号 |
DE1998635747 |
申请日期 |
1998.06.26 |
| 申请人 |
HITACHI CHEMICAL CO. LTD. |
发明人 |
URASAKI, NAOYUKI;SHIMADA, YASUSHI;TSURU, YOSHIYUKI;NAKASO, AKISHI;WATANABE, ITSUO |
| 分类号 |
H01L23/12;H01L21/56;H01L21/60;H01L23/498;H01L23/538;H05K1/11;H05K1/18;H05K3/28;H05K3/32 |
主分类号 |
H01L23/12 |
| 代理机构 |
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