| 摘要 |
A sensor array having a plurality of pixels each including a sensor element coupled to a sensor input ( 24 ) of an electronic processing circuit is fabricated by first forming an integrated circuit having at least one array of electronic processing circuits ( 25, 26 ) each having a respective sensor input ( 24 ) disposed with terminal nodes of the integrated circuit toward a first surface of the wafer. In respect of either each pixel or each terminal node, an electrically conductive via ( 31 ) is formed through the wafer ( 20 ) extending from either the respective sensor input ( 24 ) or from the respective terminal node to a second surface ( 28 ) of the wafer opposite the first surface. This allows each electrically conductive via ( 31 ) exposed at the second surface of the wafer to serve for connection thereto of either a sensor element or a terminal connection that is electrically connected through the electrically conductive via ( 31 ) to the respective sensor input or terminal node. |
