发明名称 Transdermalpflaster und Verfahren zu dessen Herstellung
摘要 <p>The present invention relates to a patch containing a substrate, a non-crosslinked adhesive layer (A) containing a drug laminated on one surface of the substrate and a crosslinked adhesive layer (B) laminated on the adhesive layer (A). According to the present invention, the percutaneous absorbability of the drug can be improved, and a patch free of problems such as adhesive residue and adhesive bleed can be provided.The present invention relates to a patch containing a substrate, a non-crosslinked adhesive layer (A) containing a drug laminated on one surface of the substrate and a crosslinked adhesive layer (B) laminated on the adhesive layer (A). According to the present invention, the percutaneous absorbability of the drug can be improved, and a patch free of problems such as adhesive residue and adhesive bleed can be provided.</p>
申请公布号 DE60303326(T2) 申请公布日期 2006.10.12
申请号 DE2003603326T 申请日期 2003.04.11
申请人 NITTO DENKO CORP. 发明人 HORI, MITSUHIKO;YAMAMOTO, KEIJI;MATSUOKA, KENSUKE;NAKANO, YOSHIHISA
分类号 A61K9/70;A61K47/32 主分类号 A61K9/70
代理机构 代理人
主权项
地址
您可能感兴趣的专利