| 摘要 |
PROBLEM TO BE SOLVED: To provide a conductivity path establishment structure of an electronic component which can markedly reduce the installation space for an anisotropic conductive adhesive material, can also reduce the number of processes for establishing the conductivity path of the electronic component, and can promote the reduction in the size and the cost of a product to apply this structure to. SOLUTION: Lead wires 8 extracted from an electrode 5 are arranged on a projection of a glass substrate 1 of a liquid-crystal display device; and a driver chip 9 for driving the liquid-crystal display device and a flexible wiring board 10 for supplying a signal voltage to the driver chip 9 are arranged at predetermined places of the projecting portion via one piece of the anisotropic conductive adhesive material 11, so that a conductivity path is established between them. The average grain diameter of conductive particles 11b in the anisotropic conductive adhesive material 11 is so prepared as to be 1/4 or smaller than the arrangement pitch of terminal electrodes 9a of the driver chip 9. COPYRIGHT: (C)2007,JPO&INPIT
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