发明名称 METHOD FOR FORMING CONDUCTIVE PATTERN
摘要 PROBLEM TO BE SOLVED: To provide a method for forming a smooth conductive pattern finer thanμm level in a step simpler and more convenient than by printing. SOLUTION: In the method for forming a conductive pattern, a conductive ink composition 2 is transferred onto an object 51 to be printed by inverting-offset printing, and then subjected to heat treatment at an annealing temperature not lower than 120°C and not higher than 250°C. The conductive ink composition 2 contains metallic particles having a mean particle diameter of at least 50 nm, an aqueous solvent, and a water-soluble resin. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2006278845(A) 申请公布日期 2006.10.12
申请号 JP20050097447 申请日期 2005.03.30
申请人 TOPPAN PRINTING CO LTD 发明人 OKUBO TORU
分类号 H05K3/12;B41M1/02;B41M1/34;H01B13/00;H05K1/09 主分类号 H05K3/12
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