| 摘要 |
PROBLEM TO BE SOLVED: To provide a highly electrically reliable multiple unit wiring board in which the outer peripheral side of a thin and wide-area mother board is prevented from warping and the mountability of electronic components is excellent in a ceramic substrate. SOLUTION: The multiple unit wiring board comprises the mother board 101 where rectangular wiring board regions 103 are longitudinally and laterally arrayed and formed, and a waste margin region 102 is formed around the wiring board regions 103; a wiring conductor 107 formed on the surface of the wiring board regions 103; and a frame-like metallization layer formed on the surface of the waste margin region 102. The frame-like metallization layer comprises a first frame-like metallization layer 104 formed at the outer peripheral edge of the waste margin region 102, and a second frame-like metallization layer 105 formed between the wiring board regions 103 and the first frame-like metallization layer 104. COPYRIGHT: (C)2007,JPO&INPIT
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