| 摘要 |
PROBLEM TO BE SOLVED: To obtain an ultraviolet-curing type resin composition that is useful as a solder resist for a flexible printed wiring board, has low hydrolyzability, excellent solder heat resistance, electrical insulating properties, is halogen-free and has stable flame retardance, excellent flex resistance, slight warpage after curing and excellent productivity and workability and its cured coating film. SOLUTION: The composition comprises (A) a compound containing one or more ethylenic unsaturated bonds in one molecule, (B) a phosphoric acid amide compound represented by general formula (I) and (C) a photopolymerization initiator. The composition comprises (A-1) a compound containing two or more ethylenic unsaturated bonds in one molecule and a polybutadiene skeleton as (A) the compound containing one or more ethylenic unsaturated bonds in one molecule. COPYRIGHT: (C)2007,JPO&INPIT
|
