| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a driller for a semiconductor wafer capable of stably and surely boring a fine circular hole, and repeatedly using a durable ball for drilling a hole. <P>SOLUTION: This driller for a semiconductor wafer at least includes: a stage 4 for holding a semiconductor wafer W; the ball 1 for drilling a hole in the semiconductor wafer W held on the stage 4; and a rotating mechanism 15 for holding the ball 1 and rotating it. The rotating mechanism 15 at least includes: a driving shaft 2 for rotating the ball 1; and a rotatable driven receiver 3 for supporting the ball 1 from the opposite side of the driving shaft 2, wherein the ball 1 made of silicon carbide is held by the driven receiver 3 and the driving shaft 2, the driving shaft 2 is rotated to rotate the ball 1 and supply a polishing agent, and the ball 1 is brought into contact with the semiconductor wafer W held on the stage 4, thereby drilling a hole in the semiconductor wafer W. <P>COPYRIGHT: (C)2007,JPO&INPIT |
