ALUMINA SUBSTRATE AND ITS CIRCUIT FORMING METHOD

摘要

PROBLEM TO BE SOLVED: To provide an alumina substrate which enhances efficiency of various kinds of devices to be packaged on a substrate surface by enhancing the heat radiation characteristic of a circuit substrate having intricate shapes.

SOLUTION: The alumina substrate is obtained by molding/sintering a material for molding containing an alumina powder composition composed of 20 to 40 mass% first alumina powder of 0.3 to 0.7 μm in central grain size and 60 to 80 mass% second alumina powder of 1.5 to 2.8 μm in central grain size.

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