发明名称 THIN FILM MANUFACTURING APPARATUS, METHOD OF MANUFACTURING THE SAME AND THIN FILM LAMINATE
摘要 PROBLEM TO BE SOLVED: To provide a thin film manufacturing apparatus and a method, and a thin film laminate which suppresses the radiation heat of a catalyst to a substrate, and moves a decomposed species to arrive at the substrate. SOLUTION: The thin film manufacturing apparatus 1 reacts one or more kinds of raw material gases under reduced pressure to form a thin film on a Si substrate 21 disposed in a chamber 17. It has one or more gas introducing pipes 13 disposed in the chamber 17 for introducing the raw material gases, a catalyst 10 disposed in the opening of the gas introducing pipe 13 kept at a specified distance from the Si substrate 21 for decomposing the raw material gases, and a shroud 82 for absorbing those not decomposed raw material gases without residing them in the chamber 17, thus irradiating the Si substrate 21 with the raw materials each in the form of a molecular beam. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2006278616(A) 申请公布日期 2006.10.12
申请号 JP20050093948 申请日期 2005.03.29
申请人 FURUKAWA ELECTRIC CO LTD:THE 发明人 SHINAGAWA TATSUSHI;ISHII HIROTATSU;KASUKAWA AKIHIKO
分类号 H01L21/205;C23C16/44;C23C16/452 主分类号 H01L21/205
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