发明名称 Multi-wire board, its manufacturing method, and electronic apparatus having the multi-wire board
摘要 A multi-wire board includes first and second substrates, and plural wires that connect the first and second substrates to each other, and expose to the outside, wherein the wires form a predetermined pattern in the first substrate.
申请公布号 US2006225276(A1) 申请公布日期 2006.10.12
申请号 US20060442138 申请日期 2006.05.30
申请人 FUJITSU LIMITED 发明人 MORITA YOSHIHIRO
分类号 H01R43/00;H05K1/00;H05K1/11;H05K3/00;H05K3/10 主分类号 H01R43/00
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