发明名称 |
Multi-wire board, its manufacturing method, and electronic apparatus having the multi-wire board |
摘要 |
A multi-wire board includes first and second substrates, and plural wires that connect the first and second substrates to each other, and expose to the outside, wherein the wires form a predetermined pattern in the first substrate. |
申请公布号 |
US2006225276(A1) |
申请公布日期 |
2006.10.12 |
申请号 |
US20060442138 |
申请日期 |
2006.05.30 |
申请人 |
FUJITSU LIMITED |
发明人 |
MORITA YOSHIHIRO |
分类号 |
H01R43/00;H05K1/00;H05K1/11;H05K3/00;H05K3/10 |
主分类号 |
H01R43/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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