发明名称 |
METHOD FOR SURFACE TREATMENT OF BOARD, METHOD FOR FORMING WIRING, APPARATUS FOR FORMING WIRING AND WIRING SUBSTRATE |
摘要 |
The present invention relates to a method of surface treatment, a method for forming circuit lines, a printed circuit board formed thereby, and an apparatus for forming circuit lines on a substrate, wherein fine circuit lines are formed simply, rapidly, and economically. The method for forming circuit lines of the present invention comprises: (a) selectively applying a surface treatment solution which includes an alkali metal compound on a base film in accordance with circuit patterns by a discharging method; (b) applying a conductive ink which includes metal nanoparticles in accordance with the surface-treated circuit pattern; and (c) curing the base film on which the conductive ink is applied under a reduction atmosphere lines. |
申请公布号 |
KR20060105111(A) |
申请公布日期 |
2006.10.11 |
申请号 |
KR20050027508 |
申请日期 |
2005.04.01 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
BAIK, YOON AH;JUNG, HYUN CHUL |
分类号 |
H05K3/00 |
主分类号 |
H05K3/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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