发明名称 |
Semiconductor device and method of manufacturing thereof |
摘要 |
<p>A method of manufacturing a semiconductor device sealed in a cured silicone body by placing a semiconductor device into a mold and subjecting a curable silicone composition that fills the spaces between said mold and said semiconductor device to compression molding, wherein the curable silicone composition comprises the following components: (A) an organopolysiloxane having at least two alkenyl groups per molecule; (B) an organopolysiloxane having at least two silicon-bonded hydrogen atoms per molecule; (C) a platinum-type catalyst; and (D) a filler, wherein either at least one of components (A) and (B) contains a T-unit siloxane and/or Q-unit siloxane. By the utilization this method, a sealed semiconductor device is free of voids in the sealing material, and a thickness of the cured silicone body can be controlled.</p> |
申请公布号 |
EP1709673(A1) |
申请公布日期 |
2006.10.11 |
申请号 |
EP20040801693 |
申请日期 |
2004.12.07 |
申请人 |
DOW CORNING TORAY CO., LTD. |
发明人 |
MORITA, Y.;MINE, KATSUTOSHI;NAKANISHI, J.;ENAMI, H. |
分类号 |
H01L21/56;C08L83/04;C08L83/08;H01L23/29;H01L23/31 |
主分类号 |
H01L21/56 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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