发明名称 |
Multi-layer overlay measurement and correction technique for ic manufacturing |
摘要 |
A system facilitating measurement and correction of overlay between multiple layers of a wafer is disclosed. The system comprises an overlay target that represents overlay between three or more layers of a wafer and a measurement component that determines overlay error existent in the overlay target, thereby determining overlay error between the three or more layers of the wafer. A control component can be provided to correct overlay error between adjacent and non-adjacent layers, wherein the correction is based at least in part on measurements obtained by the measurement component. |
申请公布号 |
GB0617132(D0) |
申请公布日期 |
2006.10.11 |
申请号 |
GB20060017132 |
申请日期 |
2005.02.26 |
申请人 |
ADVANCED MICRO DEVICES, INC |
发明人 |
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分类号 |
G01N21/956;G03F7/20;H01L21/66;H01L23/544 |
主分类号 |
G01N21/956 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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