METHOD OF BONDING BETWEEN CERAMIC AND METAL IN THE LED PACKAGE

摘要

A method for bonding a ceramic and a metal in an LED package is provided to improve heat release by interposing a solder paste between the ceramic and the metal where metal layers are formed. A first metal layer(81) of Ag or AgPd is formed on a surface of ceramic(40). A second metal layer(82) of Ni is formed on the first metal layer. A third metal layer(83) of Ag or Au is formed on the second metal layer. A first metal layer(91) of Ni is formed on a surface of a metal(70). A second metal layer(92) of Ag of Au is formed on the first metal layer. A solder paste(95) is interposed between the metal and the ceramic where the metal layers are formed, thereby bonding the metal and the ceramic.