THE TROBLESHOOTING OF ELECTROLESS PLATING ON AL PAD OF SIO2 WAFER DOPED BORON,申请号KR20050027685-传众专利搜索

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发明名称	THE TROBLESHOOTING OF ELECTROLESS PLATING ON AL PAD OF SIO2 WAFER DOPED BORON
摘要
申请公布号	KR20060105213(A)	申请公布日期	2006.10.11
申请号	KR20050027685	申请日期	2005.04.01
申请人	INDUSTRY-ACADEMIC COOPERATION FOUNDATION, YEUNGNAM UNIVERSITY	发明人	MIN, BONG KI;CHOI, SOON DON;AN, SU BONG;SIM, GI JONG
分类号	H01L21/60;H01L21/265	主分类号	H01L21/60
代理机构		代理人
主权项
地址

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