Circuit member for semiconductor device, semiconductor device using the same, and process for producing said circuit member and said semiconductor device

摘要

Disclosed are a circuit member, which can cope with an ever-increasing demand for multiple terminals and is advantageous in productivity, cost, and quality, a semiconductor device using the circuit member, a process for producing the circuit member, and a process for producing a semiconductor device using the circuit member. The circuit member for a semiconductor device comprises: a conductive substrate; and a circuit section two-dimensionally formed using a conductive metal by plating on the conductive substrate, a part of the conductive metal constituting the circuit section being provided by plating on one side of the conductive substrate after subjecting the one side of the conductive substrate to surface treatment to create irregularities and to release treatment to impart releasability. The circuit section comprises a lead for electrical connection to a semiconductor element, and an external terminal section for electrical connection to an external circuit, a plurality of sets of the lead and the external terminal section integrally connected to each other being provided independently of each other. The external terminal section in the circuit section is provided directly on one side of the conductive substrate by electroplating, and the lead in the circuit section is provided on an insulating epoxy resin layer, the insulating epoxy resin layer having been provided directly on the conductive substrate excluding the external terminal forming area.