METHOD FOR FORMING RESIST PATTERN

摘要

A method for forming a resist pattern is provided to reduce fabrication costs by irradiating a laser beam onto a selected region alone using a heat generating layer. A resist layer(11b) is formed on a substrate(10). A pre-bake is performed on the resist layer. An exposure process is performed on the resultant structure. A heat generating layer(12) is formed on the resist layer. A post exposure bake is performed on a selected region of the resist layer by irradiating a laser beam onto a predetermined portion of the heat generating layer. A silylation process is performed on the resist layer using a silylation agent. A developing process is performed thereon.