| 摘要 |
FIELD: chip-cards with displays. ^ SUBSTANCE: chip-card 1 has processor P and controller C of display, made in form of one chip 5, which is positioned on the same substrate 4, on which display 2 is made, while substrate 4 of display with processor P of chip positioned on it or, at least, with current-conductive tracks leading to it from processor P is preferably overlapped by contact area 3, present on chip-card 1, approaching it from below. ^ EFFECT: increased protection of semiconductor components of chip-card from destruction. ^ 3 cl, 2 dwg |
