发明名称 Semiconductor workpiece processing methods
摘要 Semiconductor processor systems, systems configured to provide a semiconductor workpiece process fluid, semiconductor workpiece processing methods, methods of preparing semiconductor workpiece process fluid, and methods of delivering semiconductor workpiece process fluid to a semiconductor processor are provided. One aspect of the invention provides a semiconductor processor system including a process chamber adapted to process at least one semiconductor workpiece using a process fluid; a connection coupled with the process chamber and configured to receive the process fluid; a sensor coupled with the connection and configured to output a signal indicative of the process fluid; and a control system coupled with the sensor and configured to control at least one operation of the semiconductor processor system responsive to the signal.
申请公布号 US7118447(B2) 申请公布日期 2006.10.10
申请号 US20030461529 申请日期 2003.06.12
申请人 MICRON TECHNOLOGY, INC. 发明人 MOORE SCOTT E.;MEIKLE SCOTT G.;CRUM MAGDEL
分类号 B24B1/00;B24B37/04;B24B49/10;B24B51/00;B24B57/02 主分类号 B24B1/00
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