| 摘要 |
An end face polishing apparatus has a support member mounted on the main body for undergoing revolving and rotational movement during a polishing operation, a tubular member mounted on the support member for rotation and revolving movement therewith, a lapping member mounted on the support member for rotation and revolving movement therewith, and a polishing fixture for supporting at least one workpiece having an end face for pressure contact with the lapping member to polish the end face of the workpiece during rotation and revolving movement of the lapping member. The polishing fixture has radially outwardly projecting guide members for contacting the tubular member to limit the amount of polishing of the end face of the workpiece in a pressing direction during rotation and revolving movement of the lapping member.
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