| 发明名称 |
Method for high volume assembly of radio frequency identification tags |
| 摘要 |
A method for assembling a plurality of electronic devices is described. A plurality of dies separated die from a wafer are attached to a support surface. The plurality of dies is transferred from the support surface to a substrate structure that includes a plurality of tag substrates.
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| 申请公布号 |
US7117581(B2) |
申请公布日期 |
2006.10.10 |
| 申请号 |
US20020322467 |
申请日期 |
2002.12.19 |
| 申请人 |
SYMBOL TECHNOLOGIES, INC. |
发明人 |
ARNESON MICHAEL R;BANDY WILLIAM R |
| 分类号 |
H01P11/00;G06K19/077;H01L21/56;H01L21/68;H01L23/498 |
主分类号 |
H01P11/00 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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