| 摘要 |
Semiconductor chip packages of a wafer level and method for fabricating the same are disclosed, in which a wafer electrode pad is connected with an external circuit by a via-electrode penetrating a silicon wafer. An illustrated example package includes a wafer having a first surface and a second surface opposite the first surface; a semiconductor device having at least one of electrode pad on the first surface; a protective layer covering the first surface of the silicon wafer; a via-hole from the second surface to the electrode pad on the first surface, a via electrode within the via-hole; and a solder ball or a solder bump on the second surface for electrical connection between the via-electrode and an external circuit.
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