| 摘要 |
A chip carrier having improver thermal properties, wherein the chip carrier may be formed having waist section, and a first transverse end portion joined to the waist section. A first surface of the carrier being configured to receive a chip thereon, and a second surface of the carrier configured to be coupled to a thermal control unit to provide cooling of the carrier and chip. The chip carrier may have a second transverse end portion joined to the waist portion in certain embodiments.
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