发明名称 Composition for forming porous film, porous film and method for forming the same, interlevel insulator film
摘要 Provided is a coating liquid which can easily form a porous film having desirably controlled thickness by the method used for a usual semiconductor process, and having an excellent mesopore channel structure. Specifically provided is a composition for forming porous film comprising a surfactant, an aprotic polar solvent and a solution comprising a polymer formed by hydrolysis and condensation of one or more silane compounds represented by foramula (1): RnSi(OR')<SUB>4-n</SUB>. Also provided is a method for manufacturing a porous film comprising steps of applying said composition so as to form a film, drying the film and transforming the dried film to a porous film by removing said surfactant. The porous film obtained from the composition for forming porous film is further provided.
申请公布号 US7119354(B2) 申请公布日期 2006.10.10
申请号 US20040810360 申请日期 2004.03.26
申请人 MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. 发明人 YAGIHASHI FUJIO;HAMADA YOSHITAKA;NAKAGAWA HIDEO;SASAGO MASARU
分类号 C01B33/12;H01L47/00;C09D183/00;H01L21/312;H01L21/316;H01L21/768 主分类号 C01B33/12
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